App.：Digital Electronics
Thickness：0.9mm
Surface treatment：ENIG+OSP
Material：FR4 IT-170GRAI
Layer：10L ELIC(4+2+4)
App.：LED HDI
Typical technical specification:
Thickness：2.0mm
Surface treatment：ENIG
Material：FR4 TG150
Layer：8L HDI(2+2+2)
Min. Technical Holes：None(Only design laser drill and depth control drill)
